Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11205606 | Semiconductor device package | Hung-Hsien Huang, Shin-Luh TARNG | 2021-12-21 |
| 11139226 | Semiconductor package structure and assembly structure | Ian HU, Hung-Hsien Huang | 2021-10-05 |
| 11081420 | Substrate structure and semiconductor package structure | Ian HU, Chih-Pin Hung | 2021-08-03 |
| 11024557 | Semiconductor package structure having vapor chamber thermally connected to a surface of the semiconductor die | Ian HU, Jin-Feng Yang | 2021-06-01 |