Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11075186 | Semiconductor package | Ian HU, Jia-Rung Ho, Chih-Pin Hung, Ping-Feng Yang | 2021-07-27 |
| 11024557 | Semiconductor package structure having vapor chamber thermally connected to a surface of the semiconductor die | Hsin-En Chen, Ian HU | 2021-06-01 |