Issued Patents 2021
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11152274 | Multi-moldings fan-out package and process | Wei-Hsuan Lee, Sung-Mao Li, Ming-Han Wang | 2021-10-19 | $2,754,000 |
| 11139222 | Electronic device comprising heat pipe contacting a cover structure for heat dissipation | Jung-Che Tsai, Chih-Pin Hung | 2021-10-05 | $907,000 |
| 11139226 | Semiconductor package structure and assembly structure | Hsin-En Chen, Hung-Hsien Huang | 2021-10-05 | $907,000 |
| 11081420 | Substrate structure and semiconductor package structure | Hsin-En Chen, Chih-Pin Hung | 2021-08-03 | $3,865,000 |
| 11075186 | Semiconductor package | Jia-Rung Ho, Jin-Feng Yang, Chih-Pin Hung, Ping-Feng Yang | 2021-07-27 | $5,401,000 |
| 11024557 | Semiconductor package structure having vapor chamber thermally connected to a surface of the semiconductor die | Hsin-En Chen, Jin-Feng Yang | 2021-06-01 | $2,470,000 |
| 10985085 | Semiconductor device package and method for manufacturing the same | Chih-Pin Hung, Meng-Kai SHIH | 2021-04-20 | $9,040,000 |