Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11152274 | Multi-moldings fan-out package and process | Wei-Hsuan Lee, Sung-Mao Li, Ian HU | 2021-10-19 | $2,754,000 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11152274 | Multi-moldings fan-out package and process | Wei-Hsuan Lee, Sung-Mao Li, Ian HU | 2021-10-19 | $2,754,000 |