Issued Patents 2019
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522487 | Semiconductor structure and manufacturing method thereof | Sheng-Chau Chen, Ming-Che Lee, Kuo-Ming Wu, Cheng-Hsien Chou, Cheng-Yuan Tsai +1 more | 2019-12-31 |
| 10515995 | Bond pad structure for bonding improvement | Sin-Yao Huang, Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung, Ming-Tsong Wang | 2019-12-24 |
| 10510799 | Absorption enhancement structure for image sensor | Ching-Chung Su, Hung-Wen Hsu, Jiech-Fun Lu | 2019-12-17 |
| 10510729 | 3DIC interconnect apparatus and method | Shu-Ting Tsai, Dun-Nian Yaung, Jen-Cheng Liu, U-Ting Chen | 2019-12-17 |
| 10395974 | Method for forming a thin semiconductor-on-insulator (SOI) substrate | Hung-Wen Hsu, Jiech-Fun Lu, Yu-Hung Cheng, Yung-Lung Lin, Min-Ying Tsai | 2019-08-27 |
| 10361234 | 3DIC interconnect apparatus and method | Hung-Wen Hsu, Ching-Chung Su, Chun-Han Tsao, Chia-Chieh Lin, Shu-Ting Tsai +4 more | 2019-07-23 |
| 10325956 | Deep trench isolation shrinkage method for enhanced device performance | Cheng-Hsien Chou, Chih-Yu Lai, Sheng-Chau Chen, Chih-Ta Chen, Yeur-Luen Tu +1 more | 2019-06-18 |
| 10312278 | Front side illuminated image sensor device structure and method for forming the same | Tsun-Kai Tsao, Jiech-Fun Lu | 2019-06-04 |
| 10304898 | Absorption enhancement structure for image sensor | Ching-Chung Su, Hung-Wen Hsu, Jiech-Fun Lu | 2019-05-28 |
| 10283547 | Stacked image sensor having a barrier layer | U-Ting Chen, Shu-Ting Tsai, Cheng-Ying Ho, Tzu-Hsuan Hsu | 2019-05-07 |
| 10177106 | Conductive pad structure for hybrid bonding and methods of forming same | Sheng-Chau Chen, Yen-Chang Chu, Cheng-Hsien Chou, Chih-Hui Huang, Yeur-Luen Tu | 2019-01-08 |