Issued Patents 2019
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515995 | Bond pad structure for bonding improvement | Sin-Yao Huang, Ching-Chun Wang, Dun-Nian Yaung, Ming-Tsong Wang, Shih Pei Chou | 2019-12-24 |
| 10515994 | Semiconductor devices, methods of manufacturing thereof, and image sensor devices | Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu, Tzu-Hsuan Hsu, Min-Feng Kao | 2019-12-24 |
| 10515990 | Semiconductor devices having reduced noise | Jhy-Jyi Sze, Shou-Gwo Wuu | 2019-12-24 |
| 10510542 | Gate electrodes with notches and methods for forming the same | Min-Feng Kao, Szu-Ying Chen, Dun-Nian Yaung, Jen-Cheng Liu, Tzu-Hsuan Hsu | 2019-12-17 |
| 10490580 | Image sensor pickup region layout | Dun-Nian Yaung, Ching-Chun Wang, Jeng-Shyan Lin, Yan-Chih Lu | 2019-11-26 |
| 10475758 | Semiconductor device structure and method for forming the same | Ming-Hsien Yang, Ching-Chun Wang, Dun-Nian Yaung, Sin-Yao Huang | 2019-11-12 |
| 10461109 | Multiple deep trench isolation (MDTI) structure for CMOS image sensor | Wei Chuang Wu, Ching-Chun Wang, Dun-Nian Yaung, Jen-Cheng Liu, Yen-Ting Chiang +2 more | 2019-10-29 |
| 10304889 | Image sensor device and manufacturing method thereof | Wei Chuang Wu, Ming-Tsong Wang, Jen-Cheng Liu, Ching-Chun Wang | 2019-05-28 |
| 10297631 | Metal block and bond pad structure | Cheng-Ying Ho, Ching-Chun Wang, Dun-Nian Yaung, Yan-Chih Lu | 2019-05-21 |
| 10283549 | Via support structure under pad areas for BSI bondability improvement | Sin-Yao Huang, Ching-Chun Wang, Dun-Nian Yaung | 2019-05-07 |
| 10276622 | Mechanisms for forming image-sensor device with expitaxial isolation feature | Wen-I Hsu, Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu | 2019-04-30 |
| 10269768 | Stacked integrated circuits with redistribution lines | Cheng-Ying Ho, Jeng-Shyan Lin, Wen-I Hsu, Dun-Nian Yaung, Ying-Ling Tsai | 2019-04-23 |
| 10269840 | Image sensing device and manufacturing method thereof | Jen-Cheng Liu, Ching-Chun Wang, Tse-Hua Lu | 2019-04-23 |
| 10269770 | Hybrid bond pad structure | Sin-Yao Huang, Chun-Chieh Chuang, Ching-Chun Wang, Sheng-Chau Chen, Dun-Nian Yaung +1 more | 2019-04-23 |