Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10490580 | Image sensor pickup region layout | Dun-Nian Yaung, Ching-Chun Wang, Feng-Chi Hung, Jeng-Shyan Lin | 2019-11-26 |
| 10297631 | Metal block and bond pad structure | Cheng-Ying Ho, Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung | 2019-05-21 |