Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522525 | Semiconductor device structure | Wen-De Wang, Jen-Cheng Liu, Dun-Nian Yaung | 2019-12-31 |
| 10510792 | 3DIC seal ring structure and methods of forming same | Pao-Tung Chen, Wen-De Wang, Jen-Cheng Liu, Dun-Nian Yaung | 2019-12-17 |
| 10297631 | Metal block and bond pad structure | Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung, Yan-Chih Lu | 2019-05-21 |
| 10283547 | Stacked image sensor having a barrier layer | U-Ting Chen, Shu-Ting Tsai, Tzu-Hsuan Hsu, Shih Pei Chou | 2019-05-07 |
| 10269768 | Stacked integrated circuits with redistribution lines | Jeng-Shyan Lin, Wen-I Hsu, Feng-Chi Hung, Dun-Nian Yaung, Ying-Ling Tsai | 2019-04-23 |