Issued Patents 2019
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522586 | Apparatus for reducing optical cross-talk in image sensors | Chin-Min Lin, Dun-Nian Yaung, Chun-Ming Su, Tzu-Hsuan Hsu | 2019-12-31 |
| 10515995 | Bond pad structure for bonding improvement | Sin-Yao Huang, Dun-Nian Yaung, Feng-Chi Hung, Ming-Tsong Wang, Shih Pei Chou | 2019-12-24 |
| 10510789 | Extra doped region for back-side deep trench isolation | Chun-Yuan Chen, Dun-Nian Yaung, Hsiao-Hui Tseng, Jhy-Jyi Sze, Shyh-Fann Ting +4 more | 2019-12-17 |
| 10504784 | Inductor structure for integrated circuit | Shih-Han Huang, Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu, Min-Feng Kao | 2019-12-10 |
| 10490580 | Image sensor pickup region layout | Dun-Nian Yaung, Feng-Chi Hung, Jeng-Shyan Lin, Yan-Chih Lu | 2019-11-26 |
| 10475758 | Semiconductor device structure and method for forming the same | Ming-Hsien Yang, Dun-Nian Yaung, Feng-Chi Hung, Sin-Yao Huang | 2019-11-12 |
| 10461109 | Multiple deep trench isolation (MDTI) structure for CMOS image sensor | Wei Chuang Wu, Dun-Nian Yaung, Feng-Chi Hung, Jen-Cheng Liu, Yen-Ting Chiang +2 more | 2019-10-29 |
| 10304889 | Image sensor device and manufacturing method thereof | Wei Chuang Wu, Ming-Tsong Wang, Feng-Chi Hung, Jen-Cheng Liu | 2019-05-28 |
| 10297631 | Metal block and bond pad structure | Cheng-Ying Ho, Dun-Nian Yaung, Feng-Chi Hung, Yan-Chih Lu | 2019-05-21 |
| 10283549 | Via support structure under pad areas for BSI bondability improvement | Sin-Yao Huang, Dun-Nian Yaung, Feng-Chi Hung | 2019-05-07 |
| 10276618 | Extra doped region for back-side deep trench isolation | Chun-Yuan Chen, Dun-Nian Yaung, Hsiao-Hui Tseng, Jhy-Jyi Sze, Shyh-Fann Ting +4 more | 2019-04-30 |
| 10269770 | Hybrid bond pad structure | Sin-Yao Huang, Chun-Chieh Chuang, Sheng-Chau Chen, Dun-Nian Yaung, Feng-Chi Hung +1 more | 2019-04-23 |
| 10269858 | Image sensor with reduced optical path | Shyh-Fann Ting, Chen-Jong Wang, Jhy-Jyi Sze, Chun-Ming Su, Wei Chuang Wu +1 more | 2019-04-23 |
| 10269857 | Image sensor comprising reflective guide layer and method of forming the same | Wei Chuang Wu, Jhy-Jyi Sze, Yu-Jen Wang, Yen-Chang Chu, Shyh-Fann Ting | 2019-04-23 |
| 10269840 | Image sensing device and manufacturing method thereof | Feng-Chi Hung, Jen-Cheng Liu, Tse-Hua Lu | 2019-04-23 |