Issued Patents 2019
Showing 1–25 of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522741 | Under-cut via electrode for sub 60nm etchless MRAM devices by decoupling the via etch process | Yi Yang, Dongna Shen | 2019-12-31 |
| 10522753 | Highly selective ion beam etch hard mask for sub 60nm MRAM devices | Yi Yang, Dongna Shen | 2019-12-31 |
| 10522751 | MTJ CD variation by HM trimming | Dongna Shen, Yi Yang, Jesmin Haq | 2019-12-31 |
| 10522750 | Multiply spin-coated ultra-thick hybrid hard mask for sub 60nm MRAM devices | Yi Yang | 2019-12-31 |
| 10522749 | Combined physical and chemical etch to reduce magnetic tunnel junction (MTJ) sidewall damage | Dongna Shen, Ru-Ying Tong, Vignesh Sundar, Sahil Patel | 2019-12-31 |
| 10522746 | Dual magnetic tunnel junction devices for magnetic random access memory (MRAM) | Vignesh Sundar, Luc Thomas, Guenole Jan | 2019-12-31 |
| 10522745 | Low resistance MgO capping layer for perpendicularly magnetized magnetic tunnel junctions | Sahil Patel, Guenole Jan, Ru-Ying Tong, Vignesh Sundar, Dongna Shen +2 more | 2019-12-31 |
| 10516100 | Silicon oxynitride based encapsulation layer for magnetic tunnel junctions | Vignesh Sundar, Dongna Shen, Sahil Patel, Ru-Ying Tong | 2019-12-24 |
| 10516102 | Multiple spacer assisted physical etching of sub 60nm MRAM devices | Yi Yang, Dongna Shen | 2019-12-24 |
| 10516101 | Physical cleaning with in-situ dielectric encapsulation layer for spintronic device application | Keyu Pi, Ru-Ying Tong | 2019-12-24 |
| 10510789 | Extra doped region for back-side deep trench isolation | Chun-Yuan Chen, Ching-Chun Wang, Dun-Nian Yaung, Hsiao-Hui Tseng, Jhy-Jyi Sze +4 more | 2019-12-17 |
| 10475991 | Fabrication of large height top metal electrode for sub-60nm magnetoresistive random access memory (MRAM) devices | Yi Yang, Zhongjian Teng, Jesmin Haq | 2019-11-12 |
| 10475828 | Image sensor device structure with doping layer in light-sensing region | Yen-Ting Chiang, Chun-Yuan Chen, Hsiao-Hui Tseng, Shyh-Fann Ting, Wei Chuang Wu +2 more | 2019-11-12 |
| 10446741 | Multiple hard mask patterning to fabricate 20nm and below MRAM devices | Yi Yang, Jesmin Haq, Tom Zhong | 2019-10-15 |
| 10440712 | Systems and methods for frequency allocation in a wireless network | Zheng Fang, Roger Danforth Bartlett, Zheng Cai | 2019-10-08 |
| 10422876 | Optical sensor arrangement | — | 2019-09-24 |
| 10418547 | Sub 60nm etchless MRAM devices by ion beam etching fabricated T-shaped bottom electrode | Yi Yang, Dongna Shen | 2019-09-17 |
| 10388862 | Highly selective ion beam etch hard mask for sub 60nm MRAM devices | Yi Yang, Dongna Shen | 2019-08-20 |
| 10359699 | Self-adaptive halogen treatment to improve photoresist pattern and magnetoresistive random access memory (MRAM) device uniformity | Yi Yang, Dongna Shen, Jesmin Haq | 2019-07-23 |
| 10342024 | Methods and systems for assigning resources to user equipment devices | Dhaval Mehta, Yun Sung Kim, Udit Thakore | 2019-07-02 |
| 10304886 | Back-side deep trench isolation (BDTI) structure for pinned photodiode image sensor | Yen-Ting Chiang, Dun-Nian Yaung, Hsiao-Hui Tseng, Jen-Cheng Liu, Chun-Yuan Chen | 2019-05-28 |
| 10297746 | Post treatment to reduce shunting devices for physical etching process | Dongna Shen, Vignesh Sundar, Sahil Patel | 2019-05-21 |
| 10291541 | Systems and methods for scheduling transmissions from an access node | Sanghoon Sung, Tri Duong, Udit Thakore | 2019-05-14 |
| 10277297 | Carrier aggregation (CA) control based on multi-user multiple input multiple output (MIMO) usage | Sanghoon Sung, Udit Thakore, Dhaval Mehta | 2019-04-30 |
| 10276618 | Extra doped region for back-side deep trench isolation | Chun-Yuan Chen, Ching-Chun Wang, Dun-Nian Yaung, Hsiao-Hui Tseng, Jhy-Jyi Sze +4 more | 2019-04-30 |