Issued Patents 2019
Showing 1–25 of 42 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522525 | Semiconductor device structure | Cheng-Ying Ho, Wen-De Wang, Jen-Cheng Liu | 2019-12-31 |
| 10522586 | Apparatus for reducing optical cross-talk in image sensors | Chin-Min Lin, Ching-Chun Wang, Chun-Ming Su, Tzu-Hsuan Hsu | 2019-12-31 |
| 10515995 | Bond pad structure for bonding improvement | Sin-Yao Huang, Ching-Chun Wang, Feng-Chi Hung, Ming-Tsong Wang, Shih Pei Chou | 2019-12-24 |
| 10515994 | Semiconductor devices, methods of manufacturing thereof, and image sensor devices | Chun-Chieh Chuang, Jen-Cheng Liu, Tzu-Hsuan Hsu, Feng-Chi Hung, Min-Feng Kao | 2019-12-24 |
| 10510791 | Elevated photodiode with a stacked scheme | Meng-Hsun Wan, Yi-Shin Chu, Szu-Ying Chen, Pao-Tung Chen, Jen-Cheng Liu | 2019-12-17 |
| 10510790 | High-k dielectric liners in shallow trench isolations | Szu-Ying Chen, Tzu-Jui Wang, Jen-Cheng Liu | 2019-12-17 |
| 10510789 | Extra doped region for back-side deep trench isolation | Chun-Yuan Chen, Ching-Chun Wang, Hsiao-Hui Tseng, Jhy-Jyi Sze, Shyh-Fann Ting +4 more | 2019-12-17 |
| 10510730 | Stacked semiconductor structure and method | Szu-Ying Chen, Meng-Hsun Wan | 2019-12-17 |
| 10510729 | 3DIC interconnect apparatus and method | Shu-Ting Tsai, Jen-Cheng Liu, U-Ting Chen, Shih Pei Chou | 2019-12-17 |
| 10510542 | Gate electrodes with notches and methods for forming the same | Min-Feng Kao, Szu-Ying Chen, Jen-Cheng Liu, Tzu-Hsuan Hsu, Feng-Chi Hung | 2019-12-17 |
| 10510592 | Integrated circuit (IC) structure for high performance and functional density | Min-Feng Kao, Hsing-Chih Lin, Jen-Cheng Liu, Kuan-Chieh Huang | 2019-12-17 |
| 10510912 | Image sensor device and method | Kuo-Chin Huang, Tzu-Jui Wang, Szu-Ying Chen, Jen-Cheng Liu, Bruce C. S. Chou +2 more | 2019-12-17 |
| 10510793 | Uniform-size bonding patterns | Szu-Ying Chen | 2019-12-17 |
| 10510792 | 3DIC seal ring structure and methods of forming same | Cheng-Ying Ho, Pao-Tung Chen, Wen-De Wang, Jen-Cheng Liu | 2019-12-17 |
| 10504784 | Inductor structure for integrated circuit | Shih-Han Huang, Ching-Chun Wang, Hsing-Chih Lin, Jen-Cheng Liu, Min-Feng Kao | 2019-12-10 |
| 10490580 | Image sensor pickup region layout | Ching-Chun Wang, Feng-Chi Hung, Jeng-Shyan Lin, Yan-Chih Lu | 2019-11-26 |
| 10475828 | Image sensor device structure with doping layer in light-sensing region | Yen-Ting Chiang, Chun-Yuan Chen, Hsiao-Hui Tseng, Yu-Jen Wang, Shyh-Fann Ting +2 more | 2019-11-12 |
| 10475843 | Method and apparatus for image sensor packaging | Szu-Ying Chen, Meng-Hsun Wan, Pao-Tung Chen, Jen-Cheng Liu | 2019-11-12 |
| 10475758 | Semiconductor device structure and method for forming the same | Ming-Hsien Yang, Ching-Chun Wang, Feng-Chi Hung, Sin-Yao Huang | 2019-11-12 |
| 10468443 | Pixel structure of image sensor and method of forming same | Tzu-Jui Wang, Keng-Yu Chou, Chun-Hao Chuang, Ming-Chieh Hsu, Ren-Jie Lin +1 more | 2019-11-05 |
| 10468441 | Semiconductor switching device separated by device isolation | Min-Feng Kao, Jen-Cheng Liu, Tzu-Hsuan Hsu, Szu-Ying Chen, Wei-Cheng Hsu +1 more | 2019-11-05 |
| 10468448 | Semiconductor image sensor and method for forming the same | Sze Jhy-Jyi, Yimin Huang | 2019-11-05 |
| 10461109 | Multiple deep trench isolation (MDTI) structure for CMOS image sensor | Wei Chuang Wu, Ching-Chun Wang, Feng-Chi Hung, Jen-Cheng Liu, Yen-Ting Chiang +2 more | 2019-10-29 |
| 10388642 | Hybrid bonding with uniform pattern density | Szu-Ying Chen | 2019-08-20 |
| 10361233 | High-k dielectric liners in shallow trench isolations | Szu-Ying Chen, Tzu-Jui Wang, Jen-Cheng Liu | 2019-07-23 |