Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515995 | Bond pad structure for bonding improvement | Sin-Yao Huang, Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung, Shih Pei Chou | 2019-12-24 |
| 10304889 | Image sensor device and manufacturing method thereof | Wei Chuang Wu, Feng-Chi Hung, Jen-Cheng Liu, Ching-Chun Wang | 2019-05-28 |