Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515995 | Bond pad structure for bonding improvement | Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung, Ming-Tsong Wang, Shih Pei Chou | 2019-12-24 |
| 10475758 | Semiconductor device structure and method for forming the same | Ming-Hsien Yang, Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung | 2019-11-12 |
| 10283549 | Via support structure under pad areas for BSI bondability improvement | Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung | 2019-05-07 |
| 10269770 | Hybrid bond pad structure | Chun-Chieh Chuang, Ching-Chun Wang, Sheng-Chau Chen, Dun-Nian Yaung, Feng-Chi Hung +1 more | 2019-04-23 |