Issued Patents 2019
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522514 | 3DIC structure and methods of forming | Kuo-Ming Wu, Yung-Lung Lin, Zhi-Yang Wang, Cheng-Hsien Chou | 2019-12-31 |
| 10522487 | Semiconductor structure and manufacturing method thereof | Shih Pei Chou, Ming-Che Lee, Kuo-Ming Wu, Cheng-Hsien Chou, Cheng-Yuan Tsai +1 more | 2019-12-31 |
| 10504756 | Wafer processing method and apparatus | Chih-Hui Huang, Chun-Han Tsao, Yeur-Luen Tu, Chia-Shiung Tsai, Xiaomeng Chen | 2019-12-10 |
| 10325956 | Deep trench isolation shrinkage method for enhanced device performance | Cheng-Hsien Chou, Shih Pei Chou, Chih-Yu Lai, Chih-Ta Chen, Yeur-Luen Tu +1 more | 2019-06-18 |
| 10283550 | Semiconductor structure, back-side illuminated image sensor and method for manufacturing the same | Cheng-Hsien Chou, Min-Feng Kao | 2019-05-07 |
| 10269770 | Hybrid bond pad structure | Sin-Yao Huang, Chun-Chieh Chuang, Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung +1 more | 2019-04-23 |
| 10177106 | Conductive pad structure for hybrid bonding and methods of forming same | Shih Pei Chou, Yen-Chang Chu, Cheng-Hsien Chou, Chih-Hui Huang, Yeur-Luen Tu | 2019-01-08 |