Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522514 | 3DIC structure and methods of forming | Kuo-Ming Wu, Zhi-Yang Wang, Sheng-Chau Chen, Cheng-Hsien Chou | 2019-12-31 |
| 10504716 | Method for manufacturing semiconductor device and manufacturing method of the same | Hau-Yi Hsiao, Chih-Hui Huang, Kuo-Hwa Tzeng, Cheng-Hsien Chou | 2019-12-10 |
| 10453832 | Seal ring structures and methods of forming same | Kuo-Ming Wu, Kuan-Liang Liu, Wen-De Wang | 2019-10-22 |
| 10395974 | Method for forming a thin semiconductor-on-insulator (SOI) substrate | Shih Pei Chou, Hung-Wen Hsu, Jiech-Fun Lu, Yu-Hung Cheng, Min-Ying Tsai | 2019-08-27 |
| 10269770 | Hybrid bond pad structure | Sin-Yao Huang, Chun-Chieh Chuang, Ching-Chun Wang, Sheng-Chau Chen, Dun-Nian Yaung +1 more | 2019-04-23 |