Issued Patents 2019
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522514 | 3DIC structure and methods of forming | Kuo-Ming Wu, Yung-Lung Lin, Zhi-Yang Wang, Sheng-Chau Chen | 2019-12-31 |
| 10522487 | Semiconductor structure and manufacturing method thereof | Sheng-Chau Chen, Shih Pei Chou, Ming-Che Lee, Kuo-Ming Wu, Cheng-Yuan Tsai +1 more | 2019-12-31 |
| 10504716 | Method for manufacturing semiconductor device and manufacturing method of the same | Yung-Lung Lin, Hau-Yi Hsiao, Chih-Hui Huang, Kuo-Hwa Tzeng | 2019-12-10 |
| 10325949 | Image Sensor Device | Chao-Ching Chang, Sheng-Chan Li, Tsung-Wei Huang, Min-Hui Lin, Yi-Ming Lin | 2019-06-18 |
| 10325956 | Deep trench isolation shrinkage method for enhanced device performance | Shih Pei Chou, Chih-Yu Lai, Sheng-Chau Chen, Chih-Ta Chen, Yeur-Luen Tu +1 more | 2019-06-18 |
| 10319768 | Image sensor scheme for optical and electrical improvement | Sheng-Chan Li, Cheng-Yuan Tsai, Keng-Yu Chou, Yeur-Luen Tu | 2019-06-11 |
| 10283550 | Semiconductor structure, back-side illuminated image sensor and method for manufacturing the same | Sheng-Chau Chen, Min-Feng Kao | 2019-05-07 |
| 10204822 | Method for forming trench liner passivation | Hung-Ling Shih, Tsun-Kai Tsao, Ming-Huei Shen, Kuo-Hwa Tzeng, Yeur-Luen Tu | 2019-02-12 |
| 10177106 | Conductive pad structure for hybrid bonding and methods of forming same | Sheng-Chau Chen, Shih Pei Chou, Yen-Chang Chu, Chih-Hui Huang, Yeur-Luen Tu | 2019-01-08 |