Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510798 | Method of forming deep trench isolation in radiation sensing substrate and image sensor device | Chi-Ming Lu, Jung-Chih Tsao, Yao-Hsiang Liang, Chih-Chang Huang, Ching-Ho Hsu | 2019-12-17 |
| 10504716 | Method for manufacturing semiconductor device and manufacturing method of the same | Yung-Lung Lin, Hau-Yi Hsiao, Kuo-Hwa Tzeng, Cheng-Hsien Chou | 2019-12-10 |
| 10504756 | Wafer processing method and apparatus | Chun-Han Tsao, Sheng-Chau Chen, Yeur-Luen Tu, Chia-Shiung Tsai, Xiaomeng Chen | 2019-12-10 |
| 10475847 | Semiconductor device having stress-neutralized film stack and method of fabricating same | Chi-Ming Lu, Sheng-Chan Li, Jung-Chih Tsao, Yao-Hsiang Liang | 2019-11-12 |
| 10177106 | Conductive pad structure for hybrid bonding and methods of forming same | Sheng-Chau Chen, Shih Pei Chou, Yen-Chang Chu, Cheng-Hsien Chou, Yeur-Luen Tu | 2019-01-08 |