Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510729 | 3DIC interconnect apparatus and method | Shu-Ting Tsai, Dun-Nian Yaung, Jen-Cheng Liu, Shih Pei Chou | 2019-12-17 |
| 10304818 | Method of manufacturing semiconductor devices having conductive plugs with varying widths | Shu-Ting Tsai, Dun-Nian Yaung, Jen-Cheng Liu, Szu-Ying Chen | 2019-05-28 |
| 10283547 | Stacked image sensor having a barrier layer | Shu-Ting Tsai, Cheng-Ying Ho, Tzu-Hsuan Hsu, Shih Pei Chou | 2019-05-07 |
| 10269843 | BSI image sensor and method of forming same | Hung-Wen Hsu, Jiech-Fun Lu, Yeur-Luen Tu, Shu-Ting Tsai, Hsiu-Yu Cheng | 2019-04-23 |