Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510729 | 3DIC interconnect apparatus and method | Dun-Nian Yaung, Jen-Cheng Liu, U-Ting Chen, Shih Pei Chou | 2019-12-17 |
| 10361234 | 3DIC interconnect apparatus and method | Shih Pei Chou, Hung-Wen Hsu, Ching-Chung Su, Chun-Han Tsao, Chia-Chieh Lin +4 more | 2019-07-23 |
| 10304818 | Method of manufacturing semiconductor devices having conductive plugs with varying widths | Dun-Nian Yaung, Jen-Cheng Liu, Szu-Ying Chen, U-Ting Chen | 2019-05-28 |
| 10283547 | Stacked image sensor having a barrier layer | U-Ting Chen, Cheng-Ying Ho, Tzu-Hsuan Hsu, Shih Pei Chou | 2019-05-07 |
| 10269843 | BSI image sensor and method of forming same | Hung-Wen Hsu, Jiech-Fun Lu, Yeur-Luen Tu, U-Ting Chen, Hsiu-Yu Cheng | 2019-04-23 |