Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510799 | Absorption enhancement structure for image sensor | Hung-Wen Hsu, Jiech-Fun Lu, Shih Pei Chou | 2019-12-17 |
| 10361234 | 3DIC interconnect apparatus and method | Shih Pei Chou, Hung-Wen Hsu, Chun-Han Tsao, Chia-Chieh Lin, Shu-Ting Tsai +4 more | 2019-07-23 |
| 10304898 | Absorption enhancement structure for image sensor | Hung-Wen Hsu, Jiech-Fun Lu, Shih Pei Chou | 2019-05-28 |
| 10276427 | Semiconductor structure and manufacturing method thereof | Jiech-Fun Lu, Jian Wu, Che-Hsiang Hsueh, Ming-Chi Wu, Chi-Yuan Wen +2 more | 2019-04-30 |