Issued Patents 2019
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510542 | Gate electrodes with notches and methods for forming the same | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Tzu-Hsuan Hsu, Feng-Chi Hung | 2019-12-17 |
| 10510912 | Image sensor device and method | Kuo-Chin Huang, Tzu-Jui Wang, Dun-Nian Yaung, Jen-Cheng Liu, Bruce C. S. Chou +2 more | 2019-12-17 |
| 10510793 | Uniform-size bonding patterns | Dun-Nian Yaung | 2019-12-17 |
| 10510791 | Elevated photodiode with a stacked scheme | Meng-Hsun Wan, Yi-Shin Chu, Pao-Tung Chen, Jen-Cheng Liu, Dun-Nian Yaung | 2019-12-17 |
| 10510790 | High-k dielectric liners in shallow trench isolations | Tzu-Jui Wang, Jen-Cheng Liu, Dun-Nian Yaung | 2019-12-17 |
| 10510730 | Stacked semiconductor structure and method | Meng-Hsun Wan, Dun-Nian Yaung | 2019-12-17 |
| 10475843 | Method and apparatus for image sensor packaging | Meng-Hsun Wan, Dun-Nian Yaung, Pao-Tung Chen, Jen-Cheng Liu | 2019-11-12 |
| 10468441 | Semiconductor switching device separated by device isolation | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Tzu-Hsuan Hsu, Wei-Cheng Hsu +1 more | 2019-11-05 |
| 10388642 | Hybrid bonding with uniform pattern density | Dun-Nian Yaung | 2019-08-20 |
| 10361233 | High-k dielectric liners in shallow trench isolations | Tzu-Jui Wang, Jen-Cheng Liu, Dun-Nian Yaung | 2019-07-23 |
| 10304818 | Method of manufacturing semiconductor devices having conductive plugs with varying widths | Shu-Ting Tsai, Dun-Nian Yaung, Jen-Cheng Liu, U-Ting Chen | 2019-05-28 |
| 10297632 | Method for an image sensor device | Chun-Han Chen, Dun-Nian Yaung | 2019-05-21 |
| 10269863 | Methods and apparatus for via last through-vias | Pao-Tung Chen, Dun-Nian Yaung, Jen-Cheng Liu | 2019-04-23 |
| 10170512 | Uniform-size bonding patterns | Dun-Nian Yaung | 2019-01-01 |