Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510791 | Elevated photodiode with a stacked scheme | Meng-Hsun Wan, Yi-Shin Chu, Szu-Ying Chen, Jen-Cheng Liu, Dun-Nian Yaung | 2019-12-17 |
| 10510792 | 3DIC seal ring structure and methods of forming same | Cheng-Ying Ho, Wen-De Wang, Jen-Cheng Liu, Dun-Nian Yaung | 2019-12-17 |
| 10475772 | Seal-ring structure for stacking integrated circuits | Yi-Shin Chu, Kuan-Chieh Huang, Shuang-Ji Tsai, Yi-Hao Chen, Feng-Kuei Chang | 2019-11-12 |
| 10475843 | Method and apparatus for image sensor packaging | Szu-Ying Chen, Meng-Hsun Wan, Dun-Nian Yaung, Jen-Cheng Liu | 2019-11-12 |
| 10269863 | Methods and apparatus for via last through-vias | Szu-Ying Chen, Dun-Nian Yaung, Jen-Cheng Liu | 2019-04-23 |