Issued Patents 2018
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10125012 | MEMS device | Horst Theuss | 2018-11-13 |
| 10121690 | Method of manufacturing a semiconductor component and semiconductor component | Georg Meyer-Berg, Joachim Mahler | 2018-11-06 |
| 10115646 | Semiconductor arrangement, semiconductor system and method of forming a semiconductor arrangement | Juergen Hoegerl | 2018-10-30 |
| 10096584 | Method for producing a power semiconductor module | Olaf Hohlfeld, Guido Boenig, Irmgard Escher-Poeppel, Martin Gruber, Thorsten Meyer | 2018-10-09 |
| 10049962 | Arrangement of multiple power semiconductor chips and method of manufacturing the same | Georg Meyer-Berg, Joachim Mahler | 2018-08-14 |
| 10043782 | Electronic device package having a dielectric layer and an encapsulant | Holger Doepke, Olaf Hohlfeld, Michael Juerss | 2018-08-07 |
| 10037972 | Electronic module comprising fluid cooling channel and method of manufacturing the same | Martin Gruber, Wolfram Hable | 2018-07-31 |
| 10020285 | Method of producing a semiconductor device and a semiconductor device | Manfred Engelhardt, Hannes Eder, Bernd Roemer | 2018-07-10 |
| 9984928 | Method for producing a number of chip assemblies and method for producing a semiconductor arrangement | Olaf Hohlfeld, Gottfried Beer, Juergen Hoegerl, Peter Kanschat | 2018-05-29 |
| 9979187 | Power device with overvoltage arrester | Thomas Basler, Stephan Voss | 2018-05-22 |
| 9966277 | Arrangement and method for manufacturing the same | Markus Zundel, Andre Schmenn, Damian Sojka, Isabella Goetz, Gudrun Stranzl +3 more | 2018-05-08 |
| 9953846 | Method for fabricating a semiconductor chip panel | Daniel Porwol | 2018-04-24 |
| 9922910 | Functionalized interface structure | Ralf Otremba, Christian Kasztelan, Hsieh Ting Kuek, Teck Sim Lee, Sanjay Kumar Murugan +1 more | 2018-03-20 |