Issued Patents 2018
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10121690 | Method of manufacturing a semiconductor component and semiconductor component | Georg Meyer-Berg, Edward Fuergut | 2018-11-06 |
| 10049962 | Arrangement of multiple power semiconductor chips and method of manufacturing the same | Georg Meyer-Berg, Edward Fuergut | 2018-08-14 |
| 10038105 | Semiconductor devices, a semiconductor diode and a method for forming a semiconductor device | Thomas Basler, Hans-Joachim Schulze | 2018-07-31 |
| 10020245 | Laminate electronic device | Henrik Ewe, Anton Prueckl, Stefan Landau | 2018-07-10 |
| 9988262 | Temporary mechanical stabilization of semiconductor cavities | Dominic Maier, Daniel Porwol, Alfred Sigl | 2018-06-05 |
| 9986636 | Printed circuit boards having a dielectric layer which includes a polymer and methods of manufacturing such printed circuit boards | Ralf Otremba | 2018-05-29 |
| 9984897 | Method for manufacturing a chip arrangement including a ceramic layer | Manfred Mengel, Khalil Hosseini, Franz-Peter Kalz | 2018-05-29 |
| 9953952 | Semiconductor device having a sealant layer including carbon directly contact the chip and the carrier | Michael Juerss, Stefan Landau | 2018-04-24 |
| 9941181 | Chip package and method of forming a chip package | Heinrich Koerner, Michael Bauer, Reimund Engl, Michael Huettinger, Werner Kanert +1 more | 2018-04-10 |