Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10056295 | Method for handling a product substrate, a bonded substrate system and a temporary adhesive | Georg Meyer-Berg, Claus von Waechter, Michael Bauer, Holger Doepke, Dominic Maier +1 more | 2018-08-21 |
| 9988262 | Temporary mechanical stabilization of semiconductor cavities | Dominic Maier, Joachim Mahler, Alfred Sigl | 2018-06-05 |
| 9981843 | Chip package and a method of producing the same | Dominic Maier, Alfons Dehe, Thomas Kilger, Markus Menath, Franz-Xaver Muehlbauer +1 more | 2018-05-29 |
| 9953846 | Method for fabricating a semiconductor chip panel | Edward Fuergut | 2018-04-24 |