Issued Patents 2018
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10121690 | Method of manufacturing a semiconductor component and semiconductor component | Edward Fuergut, Joachim Mahler | 2018-11-06 |
| 10090216 | Semiconductor package with interlocked connection | Reinhard Pufall, Michael Goroll, Rainer Dudek | 2018-10-02 |
| 10056295 | Method for handling a product substrate, a bonded substrate system and a temporary adhesive | Claus von Waechter, Michael Bauer, Holger Doepke, Dominic Maier, Daniel Porwol +1 more | 2018-08-21 |
| 10049962 | Arrangement of multiple power semiconductor chips and method of manufacturing the same | Edward Fuergut, Joachim Mahler | 2018-08-14 |
| 9917036 | Chip package and a wafer level package | — | 2018-03-13 |