Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10056295 | Method for handling a product substrate, a bonded substrate system and a temporary adhesive | Georg Meyer-Berg, Claus von Waechter, Michael Bauer, Dominic Maier, Daniel Porwol +1 more | 2018-08-21 |
| 10043782 | Electronic device package having a dielectric layer and an encapsulant | Edward Fuergut, Olaf Hohlfeld, Michael Juerss | 2018-08-07 |