Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10096584 | Method for producing a power semiconductor module | Guido Boenig, Irmgard Escher-Poeppel, Edward Fuergut, Martin Gruber, Thorsten Meyer | 2018-10-09 |
| 10043782 | Electronic device package having a dielectric layer and an encapsulant | Edward Fuergut, Holger Doepke, Michael Juerss | 2018-08-07 |
| 9984928 | Method for producing a number of chip assemblies and method for producing a semiconductor arrangement | Gottfried Beer, Edward Fuergut, Juergen Hoegerl, Peter Kanschat | 2018-05-29 |
| 9972596 | Chip assemblage, press pack cell and method for operating a press pack cell | Juergen Hoegerl | 2018-05-15 |