Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10043782 | Electronic device package having a dielectric layer and an encapsulant | Edward Fuergut, Holger Doepke, Olaf Hohlfeld | 2018-08-07 |
| 9953952 | Semiconductor device having a sealant layer including carbon directly contact the chip and the carrier | Joachim Mahler, Stefan Landau | 2018-04-24 |