Issued Patents 2018
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10102967 | Method of manufacturing an inductor core for a chip assembly and chip assembly | Bernhard Knott, Rainer Leuschner | 2018-10-16 |
| 10090251 | Semiconductor chip having a dense arrangement of contact terminals | Peter Ossimitz, Juergen Hoegerl, Andreas Munding | 2018-10-02 |
| 10008470 | Embedded chip packages and methods for manufacturing an embedded chip package | Walter Hartner | 2018-06-26 |
| 9984928 | Method for producing a number of chip assemblies and method for producing a semiconductor arrangement | Olaf Hohlfeld, Edward Fuergut, Juergen Hoegerl, Peter Kanschat | 2018-05-29 |
| 9978720 | Insulated die | Horst Theuss, Juergen Hoegerl | 2018-05-22 |
| 9859251 | Semiconductor device having a chip under package | Peter Ossimitz | 2018-01-02 |