Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10090251 | Semiconductor chip having a dense arrangement of contact terminals | Gottfried Beer, Juergen Hoegerl, Andreas Munding | 2018-10-02 |
| 9871017 | Multi-level chip interconnect | Tobias Jacobs | 2018-01-16 |
| 9859251 | Semiconductor device having a chip under package | Gottfried Beer | 2018-01-02 |