Issued Patents 2018
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10128165 | Package with vertically spaced partially encapsulated contact structures | Wolfram Hable, Andreas Grassmann, Eduard Knauer, Michael Ledutke | 2018-11-13 |
| 10115646 | Semiconductor arrangement, semiconductor system and method of forming a semiconductor arrangement | Edward Fuergut | 2018-10-30 |
| 10090251 | Semiconductor chip having a dense arrangement of contact terminals | Peter Ossimitz, Gottfried Beer, Andreas Munding | 2018-10-02 |
| 10079195 | Semiconductor chip package comprising laterally extending connectors | Wolfram Hable, Martin Gruber | 2018-09-18 |
| 10002821 | Semiconductor chip package comprising semiconductor chip and leadframe disposed between two substrates | — | 2018-06-19 |
| 9984928 | Method for producing a number of chip assemblies and method for producing a semiconductor arrangement | Olaf Hohlfeld, Gottfried Beer, Edward Fuergut, Peter Kanschat | 2018-05-29 |
| 9978720 | Insulated die | Horst Theuss, Gottfried Beer | 2018-05-22 |
| 9972596 | Chip assemblage, press pack cell and method for operating a press pack cell | Olaf Hohlfeld | 2018-05-15 |
| 9924594 | Power semiconductor module and method for producing a power semiconductor module | Andre Arens, Magdalena Hoier | 2018-03-20 |