Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10128165 | Package with vertically spaced partially encapsulated contact structures | Andreas Grassmann, Juergen Hoegerl, Eduard Knauer, Michael Ledutke | 2018-11-13 |
| 10079195 | Semiconductor chip package comprising laterally extending connectors | Martin Gruber, Juergen Hoegerl | 2018-09-18 |
| 10074590 | Molded package with chip carrier comprising brazed electrically conductive layers | Mark Pavier, Angela Kessler, Michael Sielaff, Anton Pugatschow, Charles Rimbert-Riviere +1 more | 2018-09-11 |
| 10037972 | Electronic module comprising fluid cooling channel and method of manufacturing the same | Edward Fuergut, Martin Gruber | 2018-07-31 |