Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10115688 | Solder metallization stack and methods of formation thereof | Kamil Karlovsky, Evelyn Napetschnig, Michael Ehmann, Mark Harrison | 2018-10-30 |
| 10074590 | Molded package with chip carrier comprising brazed electrically conductive layers | Mark Pavier, Wolfram Hable, Angela Kessler, Michael Sielaff, Charles Rimbert-Riviere +1 more | 2018-09-11 |