Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10103076 | Semiconductor package including a semiconductor die having redistributed pads | Andrew N. Sawle, Martin Standing | 2018-10-16 |
| 10074590 | Molded package with chip carrier comprising brazed electrically conductive layers | Wolfram Hable, Angela Kessler, Michael Sielaff, Anton Pugatschow, Charles Rimbert-Riviere +1 more | 2018-09-11 |