Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10128180 | Chip packages, chip arrangements, a circuit board, and methods for manufacturing chip packages | Michael Bauer, Alfred Haimerl, Wolfgang Schober | 2018-11-13 |
| 10074590 | Molded package with chip carrier comprising brazed electrically conductive layers | Mark Pavier, Wolfram Hable, Michael Sielaff, Anton Pugatschow, Charles Rimbert-Riviere +1 more | 2018-09-11 |
| 10062671 | Circuit board embedding a power semiconductor chip | Martin Gruber, Thorsten Scharf | 2018-08-28 |
| 9859198 | Chip packages, chip arrangements, a circuit board, and methods for manufacturing chip packages | Michael Bauer, Alfred Haimerl, Wolfgang Schober | 2018-01-02 |