Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10141199 | Selecting a substrate to be soldered to a carrier | Jean-Laurent Deborde, Martin Haller, Nils Alexander Sanetra, Vasile Vartolomei | 2018-11-27 |
| 10074590 | Molded package with chip carrier comprising brazed electrically conductive layers | Mark Pavier, Wolfram Hable, Angela Kessler, Michael Sielaff, Anton Pugatschow +1 more | 2018-09-11 |