Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10074590 | Molded package with chip carrier comprising brazed electrically conductive layers | Mark Pavier, Wolfram Hable, Angela Kessler, Anton Pugatschow, Charles Rimbert-Riviere +1 more | 2018-09-11 |
| 9888601 | Semiconductor module arrangement and method for producing a semiconductor module arrangement | Patrick Jones, Christoph Koch | 2018-02-06 |