AH

Alfred Haimerl

Infineon Technologies Ag: 2 patents #201 of 864Top 25%
📍 Sinzing, DE: #3 of 18 inventorsTop 20%
Overall (2018): #168,712 of 503,207Top 35%
2
Patents 2018

Issued Patents 2018

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
10128180 Chip packages, chip arrangements, a circuit board, and methods for manufacturing chip packages Michael Bauer, Angela Kessler, Wolfgang Schober 2018-11-13
9859198 Chip packages, chip arrangements, a circuit board, and methods for manufacturing chip packages Michael Bauer, Angela Kessler, Wolfgang Schober 2018-01-02