ML

Michael Ledutke

Infineon Technologies Ag: 1 patents #355 of 864Top 45%
📍 Ribnitz-Damgarten, DE: #1 of 1 inventorsTop 100%
Overall (2018): #302,830 of 503,207Top 65%
1
Patents 2018

Issued Patents 2018

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10128165 Package with vertically spaced partially encapsulated contact structures Wolfram Hable, Andreas Grassmann, Juergen Hoegerl, Eduard Knauer 2018-11-13