Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10090251 | Semiconductor chip having a dense arrangement of contact terminals | Peter Ossimitz, Gottfried Beer, Juergen Hoegerl | 2018-10-02 |
| 10014275 | Method for producing a chip assemblage | Alexander Heinrich, Irmgard Escher-Poeppel, Martin Gruber, Catharina Wille | 2018-07-03 |