WK

Werner Kanert

Infineon Technologies Ag: 1 patents #355 of 864Top 45%
Overall (2018): #196,986 of 503,207Top 40%
1
Patents 2018

Issued Patents 2018

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9941181 Chip package and method of forming a chip package Heinrich Koerner, Michael Bauer, Reimund Engl, Michael Huettinger, Joachim Mahler +1 more 2018-04-10