HK

Heinrich Koerner

Infineon Technologies Ag: 1 patents #355 of 864Top 45%
📍 Bruckmühl, DE: #4 of 8 inventorsTop 50%
Overall (2018): #401,207 of 503,207Top 80%
1
Patents 2018

Issued Patents 2018

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9941181 Chip package and method of forming a chip package Michael Bauer, Reimund Engl, Michael Huettinger, Werner Kanert, Joachim Mahler +1 more 2018-04-10