Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9941181 | Chip package and method of forming a chip package | Heinrich Koerner, Michael Bauer, Reimund Engl, Werner Kanert, Joachim Mahler +1 more | 2018-04-10 |
MH
Michael Huettinger
Overall (2018): #304,139 of 503,207Top 65%
1
Patents 2018