Issued Patents 2018
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10147703 | Semiconductor package for multiphase circuitry device | Stefan Macheiner, Amirul Afiq Hud, Thomas Stoek, Lee Shuang Wang, Chooi Mei Chong +1 more | 2018-12-04 |
| 10083899 | Semiconductor package with heat slug and rivet free die attach area | Mohd Kahar Bajuri, Edmund Sales Cabatbat, Gaylord Evangelista Cruz, Amirul Afiq Hud, Norbert Joson Santos +2 more | 2018-09-25 |
| 10037934 | Semiconductor chip package having contact pins at short side edges | Ralf Otremba, Chooi Mei Chong, Raynold Talavera Corocotchia, Sanjay Kumar Murugan, Klaus Schiess +2 more | 2018-07-31 |
| 9991183 | Semiconductor component having inner and outer semiconductor component housings | Josef Hoeglauer, Ralf Otremba, Klaus Schiess, Xaver Schloegel, Juergen Schredl | 2018-06-05 |
| 9978671 | Power semiconductor device | Ralf Otremba, Fabio Brucchi, Xaver Schloegel, Franz Stueckler | 2018-05-22 |
| 9972576 | Semiconductor chip package comprising side wall marking | Ralf Otremba, Amirul Afiq Hud, Fabian Schnoy, Felix Grawert, Uwe Kirchner +2 more | 2018-05-15 |
| 9922910 | Functionalized interface structure | Ralf Otremba, Edward Fuergut, Christian Kasztelan, Hsieh Ting Kuek, Sanjay Kumar Murugan +1 more | 2018-03-20 |