Issued Patents 2018
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10109609 | Connection structure and electronic component | Ralf Otremba, Josef Höglauer, Jürgen Schredl, Xaver Schlögel | 2018-10-23 |
| 10074597 | Interdigit device on leadframe for evenly distributed current flow | Eung San Cho, Oliver Haeberlen, Gilberto Curatola, Gerhard Prechtl | 2018-09-11 |
| 10037934 | Semiconductor chip package having contact pins at short side edges | Ralf Otremba, Chooi Mei Chong, Raynold Talavera Corocotchia, Teck Sim Lee, Sanjay Kumar Murugan +2 more | 2018-07-31 |
| 9991183 | Semiconductor component having inner and outer semiconductor component housings | Josef Hoeglauer, Teck Sim Lee, Ralf Otremba, Xaver Schloegel, Juergen Schredl | 2018-06-05 |
| 9961798 | Package and a method of manufacturing the same | Ralf Otremba, Khalil Hosseini | 2018-05-01 |
| 9952273 | Compound semiconductor device including a sensing lead | Ralf Otremba | 2018-04-24 |
| 9899481 | Electronic component and switch circuit | Ralf Otremba | 2018-02-20 |
| 9881862 | Top side cooling for GaN power device | Ralf Otremba | 2018-01-30 |