Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10147703 | Semiconductor package for multiphase circuitry device | Stefan Macheiner, Teck Sim Lee, Thomas Stoek, Lee Shuang Wang, Chooi Mei Chong +1 more | 2018-12-04 |
| 10083899 | Semiconductor package with heat slug and rivet free die attach area | Mohd Kahar Bajuri, Edmund Sales Cabatbat, Gaylord Evangelista Cruz, Teck Sim Lee, Norbert Joson Santos +2 more | 2018-09-25 |
| 9972576 | Semiconductor chip package comprising side wall marking | Ralf Otremba, Teck Sim Lee, Fabian Schnoy, Felix Grawert, Uwe Kirchner +2 more | 2018-05-15 |