| 9847277 |
Staged via formation from both sides of chip |
Vage Oganesian, Belgacem Haba, Craig Mitchell, Piyush Savalia |
2017-12-19 |
| 9842745 |
Heat spreading substrate with embedded interconnects |
Masud Beroz |
2017-12-12 |
| 9832887 |
Micro mechanical anchor for 3D architecture |
Liang Wang, Belgacem Haba |
2017-11-28 |
| 9812433 |
Batch process fabrication of package-on-package microelectronic assemblies |
Belgacem Haba, Liang Wang |
2017-11-07 |
| 9812360 |
Systems and methods for producing flat surfaces in interconnect structures |
Cyprian Emeka Uzoh, Vage Oganesian |
2017-11-07 |
| 9761517 |
Porous alumina templates for electronic packages |
Rajesh Katkar, Cyprian Emeka Uzoh, Belgacem Haba |
2017-09-12 |
| 9716075 |
Semiconductor chip assembly and method for making same |
Teck-Gyu Kang, Wei-Shun Wang, Hiroaki Sato, Kiyoaki Hashimoto, Yoshikuni Nakadaira +3 more |
2017-07-25 |
| 9691731 |
Package-on-package assembly with wire bonds to encapsulation surface |
Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more |
2017-06-27 |
| 9685365 |
Method of forming a wire bond having a free end |
— |
2017-06-20 |
| 9659858 |
Low-stress vias |
Belgacem Haba, Cyprian Emeka Uzoh |
2017-05-23 |
| 9659812 |
Microelectronic elements with post-assembly planarization |
Vage Oganesian, Belgacem Haba, Craig Mitchell, Piyush Savalia |
2017-05-23 |
| 9640437 |
Methods of forming semiconductor elements using micro-abrasive particle stream |
Vage Oganesian, Belgacem Haba, Craig Mitchell, Piyush Savalia |
2017-05-02 |
| 9633979 |
Microelectronic assemblies having stack terminals coupled by connectors extending through encapsulation |
Belgacem Haba |
2017-04-25 |
| 9633968 |
Microelectronic packages having cavities for receiving microelectronic elements |
Belgacem Haba, Wael Zohni, Philip R. Osborn |
2017-04-25 |
| 9627366 |
Stacked microelectronic packages having at least two stacked microelectronic elements adjacent one another |
Belgacem Haba |
2017-04-18 |
| 9620437 |
Stacked microelectronic assembly with TSVS formed in stages and carrier above chip |
Vage Oganesian, Belgacem Haba, Craig Mitchell, Piyush Savalia |
2017-04-11 |
| 9615451 |
Porous alumina templates for electronic packages |
Rajesh Katkar, Cyprian Emeka Uzoh, Belgacem Haba |
2017-04-04 |
| 9615456 |
Microelectronic assembly for microelectronic packaging with bond elements to encapsulation surface |
Belgacem Haba, Terrence Caskey, Reynaldo Co, Ellis Chau |
2017-04-04 |
| 9583671 |
Quantum efficiency of multiple quantum wells |
Liang Wang, Masud Beroz |
2017-02-28 |
| 9583475 |
Microelectronic package with stacked microelectronic units and method for manufacture thereof |
Terrence Caskey |
2017-02-28 |
| 9559061 |
Substrate-to-carrier adhesion without mechanical adhesion between abutting surfaces thereof |
Belgacem Haba |
2017-01-31 |
| 9560773 |
Electrical barrier layers |
Cyprian Emeka Uzoh, Vage Oganesian, Belgacem Haba, Piyush Savalia, Craig Mitchell |
2017-01-31 |
| 9558998 |
Systems and methods for producing flat surfaces in interconnect structures |
Cyprian Emeka Uzoh, Vage Oganesian |
2017-01-31 |