| 9520376 |
Bumpless build-up layer package including an integrated heat spreader |
Deepak Kulkarni, Chia-Pin Chiu, Tannaz Harirchian, John S. Guzek |
2016-12-13 |
| 9520350 |
Bumpless build-up layer (BBUL) semiconductor package with ultra-thin dielectric layer |
Emile Davies-Venn, Ebrahim Andideh, Digvijay A. Raorane, Daniel N. Sobieski |
2016-12-13 |
| 9505610 |
Device, system and method for providing MEMS structures of a semiconductor package |
Tarek A. Ibrahim, Sarah Haney, Daniel N. Sobieski, Parshuram Balkrishna Zantye, Chad Eric Mair +1 more |
2016-11-29 |
| 9490196 |
Multi die package having a die and a spacer layer in a recess |
John S. Guzek, Shan Zhong |
2016-11-08 |
| 9437569 |
High density substrate routing in BBUL package |
Chia-Pin Chiu |
2016-09-06 |
| 9429427 |
Inductive inertial sensor architecture and fabrication in packaging build-up layers |
Qing Ma, Feras Eid, Kevin Lin, Johanna M. Swan, Valluri Rao |
2016-08-30 |
| 9368401 |
Embedded structures for package-on-package architecture |
Vinodhkumar Raghunathan |
2016-06-14 |
| 9345184 |
Magnetic field shielding for packaging build-up architectures |
Sasha N. Oster, Sarah Haney, Feras Eid |
2016-05-17 |
| 9299660 |
Controlled solder-on-die integrations on packages and methods of assembling same |
Shan Zhong |
2016-03-29 |
| 9297824 |
Techniques, systems and devices related to acceleration measurement |
Qing Ma, Valluri Rao, Feras Eid, Kevin Lin, Johanna M. Swan +1 more |
2016-03-29 |
| 9275969 |
Optical interconnect on bumpless build-up layer package |
Feras Eid, Johanna M. Swan |
2016-03-01 |
| 9242854 |
Hermetic encapsulation for microelectromechanical systems (MEMS) devices |
Sarah Haney, Feras Eid, Sasha N. Oster |
2016-01-26 |