Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9490196 | Multi die package having a die and a spacer layer in a recess | Weng Hong Teh, John S. Guzek | 2016-11-08 |
| 9435957 | Cyclic demultiplexer with grating and mirror array | Shijun Xiao | 2016-09-06 |
| 9299660 | Controlled solder-on-die integrations on packages and methods of assembling same | Weng Hong Teh | 2016-03-29 |